<p><span style="FONT-SIZE: 10.5pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'; mso-bidi-font-family: 'Times New Roman'; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;">标题</span><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: &quot;Times New Roman&quot;; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-fareast-font-family: 宋体;">:&nbsp; <span class="headNavBlueXLarge2">Towards a halogen-free package - green molding compound</span><br/></span><span style="FONT-SIZE: 10.5pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'; mso-bidi-font-family: 'Times New Roman'; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;">期刊</span><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: &quot;Times New Roman&quot;; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-fareast-font-family: 宋体;">:&nbsp; <a href="http://ieeexplore.ieee.org/xpl/RecentCon.jsp?punumber=8681"><strong>Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International</strong></a>&nbsp;&nbsp;&nbsp; Publication Date: 16-18 July 2003<br/>On page(s): 107- 115<br/><strong></strong><br/></span><span style="FONT-SIZE: 10.5pt; FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'; mso-bidi-font-family: 'Times New Roman'; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;">作者</span><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: &quot;Times New Roman&quot;; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-fareast-font-family: 宋体;">:&nbsp;<span class="bodyCopyBlackLargeSpaced">Kee, J.B.N.&nbsp;&nbsp; Yip, J.T.S.</span></span></p><p><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: &quot;Times New Roman&quot;; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-fareast-font-family: 宋体;"><span class="bodyCopyBlackLargeSpaced"></span></span><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: &quot;Times New Roman&quot;; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-fareast-font-family: 宋体;"><span class="bodyCopyBlackLargeSpaced">链接：<a href="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1225886">http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1225886</a></span></span></p>

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