欧洲一家咨询公司受欧盟委员会委托写的报告,报告名称为:The Future of Semiconductor Intellectual Property Architectural Blocks in Europe,但其实分析了全球半导体产业和IP核产业,重点分析了美国,欧洲,东亚,尤其是中国的半导体产业,尤其是产值,产业链,商业模式,具体公司分析等。
1. Executive Summary 9
2. Introduction 11
2.1. Study Theme and Motivation 11
2.1.1. European Intellectual Property Architectures in the Global Context 12
2.2. Scope of the Study 13
3. Emerging Discontinuities 17
3.1. The New Paradigm of Knowledge Economy 18
3.2. Innovation Communities and Ecosystems 22
3.3. Policy at the End of Kondratieff Waves 23
4. The Current Context of the Intellectual Property Architectural Blocks Industry 27
4.1. The Semiconductor Value System 27
4.1.1. Overview of Semiconductor Consumption and Production 27
4.1.2. Current Business Models 29
4.1.3. The Semiconductor Value Chain 38
5. The Intellectual Property Business 43
5.1. The IP Market 43
5.2. IP Customers 44
5.3. IP Providers 47
5.3.1 Top 20 IP Core Vendors 50
5.3.2. The Geographic Dimension 53
5.4 An In-Depth Look at Swedish IP Vendors 60
5.4.1. Description of the Swedish IP Vendors 61
5.5 Where Did the IP Vendors Come From? The Innovation Model 64
5.5.1. The Case of ARM Holdings 64
6. Historical Drivers in the Intellectual Property Architectural Blocks Industry 67
6.1 Semiconductor Scaling 67
6.1.1. The End of Scaling 71
6.1.2. The Long Tail of Semiconductor Products 71
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6.2. Manufacturing and Design Costs 73
6.3. Local Ecosystems and the Asian Competition 76
6.3.1. The Local Global Hub: Silicon Valley 76
6.3.2. The Move to Asia 79
7. Makimoto Waves, Dominant Designs and User Innovation 85
7.1. Learning and Obsolescence in the IC Industry 85
7.2. Cycles of Standardization and Customization 87
7.3. Configurability and Recombination 91
8. China as a Creator of Future Intellectual Property Architectural Blocks 97
8.1. The State of the IC Market 97
8.2. IC Design in China 102
8.2.1. Design Capabilities 103
8.3. Policy Issues 106
8.3.1. Export Regulations 106
8.3.2. Labour Contract Law 107
8.3.3. Investment Incentives and the New Corporate Income Tax 108
8.4. The Five Paths to the Chinese IP Future 110
8.4.1. Manufacturing Pull 110
8.4.2. Large-Market Pull 111
8.4.3. Development Policy 114
8.4.4. Competence and Innovation System 115
8.4.5. Technical Disruption 116
9. Policy Implications 119
9.1. Four Key Trends 120
9.2. Policy Alternatives 121
9.2.1. Competence Development 121
9.2.2. Expanded Access to Design Tools 122
9.2.3. Low-Cost Design Realisation Capabilities 122
9.2.4. New Design Advantages 123
9.2.5. Characterisation of Latent Demand and Supply Through Roadmap Activities 123
9.2.6. Intellectual Property Legislation 124
9.2.7. Ecosystem Openness and New Innovation Models 124
10. References 125
11. Appendix: The IC Design Process 133
11.1. The ASIC Design Flow 136
11.2. The FPGA Design Flow 138