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[外行报告] 2009年度--JP摩根--TMT--计算机,通信,电子元器件,半导体,硬件行业深度分析 [推广有奖]

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楼主
sogol001 发表于 2010-7-25 14:08:22 |AI写论文

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J.P.  Morgan -- 股票研究--硬件行业 Handbook
Tech Hardware Supply Chain  An institutional investor’s handbook to the Global Technology Hardware
(Asia Pacific Equity Research, 2009 Sixth Annual Edition)

资料非常的详实,包括产业链每个环节的分析,和每个环节里面的所有相关公司的分析和财务数据。因为是手册形式,所以非常的全和详细。最有价值的是里面完整的行业和公司数据。


文件大小: 10.7 mb
页数: 718

Table of Contents
Introduction ..............................................................................2
Part 1: Industry and Product Analysis...................6
Computing ................................................................................7
PC.......................................................................................................82
Broadband ........................................................................................52
Wireless networking..............................................................................................62
Communications ....................................................................74
Wireless Handsets ......................................................................................75
Wireless handset radio technologies....................................................................122
VOIP ........................................................................................1
Video Conferencing ..........................................................................................137
Consumer Electronics .........................................................144
Displays...............................................................................................148
IPTV....................................................................................................172
Game Consoles.......................................................................................187
DVD.................................................................................................201
Digital Still Camera.............................................................................................210
Energy Efficient Technologies ............................................223
Electronic Paper ..................................................................................................225
Solar Cells ........................................................................................231
Electric Vehicle and Battery................................................................................253
Light Emitting Diode...........................................................................................269
Semiconductors ...................................................................294
Semi manufacturing Equipment ..........................................................................295
Foundry ................................................................................................330
IC packaging and Testing....................................................................................339
Part 2: Company Information ..............................346
Semiconductors ...................................................................347
IC IDM.................................................................................................348
Memory .................................................................................................372
IC Fabless.....................................................................................379
IC Foundry .........................................................................................412
IC Assembly & Test ......................................................................................417
Semiconductor Equipment ...........................................................................425
Semiconductors Materials ............................................................................457
Components .........................................................................462
PC Handset Components...............................................................................463
Display Components ...................................................................................478
Passive Components....................................................................................485

HDD Components ........................................................................................496
Optical Components ....................................................................................499
Diversified Components.................................................................................503
PCB Substracts.........................................................................................515
Connectors.............................................................................................530
Power Supply ...........................................................................................534
Display...................................................................................538
Display Panels ........................................................................................539
LED...................................................................................................549
Display Monitors.......................................................................................554
EMS/ODM ..............................................................................557
Handset EMS/ODM .................................................................................558
PC ODM                          56
Diversified EMS..................................................................................570
Storage ..................................................................................584
HDD.................................................................................591
Optical Disc..........................................................................594
OEM.......................................................................................597
Handset OEM.........................................................................598
PC OEM.............................................................................604
Consumer Electronics..............................................................611
Diversified IT .............................................................................623
Solar Chain ...........................................................................638
Printers and Imaging............................................................649
Applied Technologies ..........................................................661
Automobiles Electronics .....................................................669
Telecom Equipment .............................................................672
Distribution ...........................................................................699
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关键词:电子元器件 JP摩根 深度分析 元器件 半导体 摩根 计算机 半导体 TMT 电子元器件

001 jp.gif (74.02 KB)

001 jp.gif

abbr_ea298390c4e34f58600b5d6a1fb6136d.pdf
下载链接: https://bbs.pinggu.org/a-700366.html

10.71 MB

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J.P. Morgan 2009 Tech Hardware Supply Chain An institutional investor’s handbook to the Global

big picture.pdf

217.78 KB

沙发
yangyi4057(未真实交易用户) 发表于 2010-7-25 14:11:18
怎么买?      抢吧

藤椅
sogol001(未真实交易用户) 发表于 2010-7-25 14:12:17
第一个是报告有10兆,700多页。

板凳
htys2018(未真实交易用户) 发表于 2010-7-25 14:33:55
顶顶  太贵了

报纸
milanzll(未真实交易用户) 发表于 2010-7-25 16:39:29
搞错了吧啊,

地板
lyenemy(未真实交易用户) 发表于 2010-7-25 21:52:02
是有点贵哦。

7
梅一诺(未真实交易用户) 发表于 2010-7-25 23:18:35
楼主想迅速致富呢

8
mhzhai(未真实交易用户) 发表于 2010-7-26 13:23:57
有点贵。。。。。。。。。

9
heffy(未真实交易用户) 发表于 2010-7-26 19:45:14
建议斑竹对这样的人限制发帖的最高限价,太过分了

10
liushistone(未真实交易用户) 发表于 2010-7-26 20:44:02
太贵了!!

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